|
|
■STI Process/ILD Process
CES-300 Series (oxide film slurry)
As a material solution, we offer Ceria slurry, based on silica-system insulating film added to a high-performance slurry with outstanding level-planarization qualities, material selectivity, and uniformity, and containing abrasive qualities. The following 2 types of slurry are available, depending on the customers supply equipment.
One-component type: Abrasive slurry and additives (premixed as a single component)
CES-303/CES-333 Series
Two-component type: Abrasive slurry and additives to be mixed together before use
CES-300/CES-2330 Series: Abrasive slurry
ADD-103 Series: Additives |
|
■Copper interconnection damascene process
For copper interconnection materials, we offer 2-step abrasive slurry using copper and barrier-metals, enabling low pressure grinding for Low-k materials.
Our barrier-metal slurries enable us an ideal selectivity in response to any customer needs, the materials for every type of film: copper, barrier-metal, Low-k materials, and so on.
CL-1100 Series: Copper-use slurry (highly abrasive rate)
CL-1200 Series: Copper-use slurry
CL-2000 Series: Barrier-metal use slurry |
|
|
